Today: September 28, 2016, 7:09 pm

Flip chip technology market by wafer bumping process totalled US$20Bn in 2013
Flip-Chip Technologies and Global Markets - a new market research report on 2014-04-29 05:09:02
The global market for Flip Chip Technology by wafer bumping process reached $18.9 billion in 2012. This market is expected to grow to $20.1 billion in 2013 and $36.5 billion in 2018, a compound annual growth rate (CAGR) of 12.7% over the five-year period from 2013 to 2018.

Cu pillar process, as a segment is expected to reach $7.3 billion in 2013. It is further expected to grow to nearly $24.9 billion in 2018, a CAGR of 27.6% over the five-year period from 2013 to 2018.

Gold stud bumping process, as a segment is expected to reach $5.5 billion in 2013. It is further expected to grow to $6.0 billion in 2018, a CAGR of 1.6% over the five-year period from 2013 to 2018.

The global market for flip chip technology was valued at $18.9 billion in 2012 and is expected to increase to $20.1 billion in 2013. BCC Research projects the market to grow to nearly $36.5 billion by 2018, and register a five-year compound annual growth rate of 12.7% from 2013 to 2018.

Flip chip technology has enabled electronics technology to reach new levels of performance, while fueling the growth of global markets for semiconductors, electronic devices and a host of industrial and consumer products. In recent years, the growth of flip chip interconnect technology over other interconnect technologies has been remarkable because of the increasing complexity of the architecture of chip design and fabrication.

Flip chip technology is used to interconnect semiconductor devices, such as integrated circuits (ICs), to external circuitry by means of solder bumps that have been deposited onto chip pads. Traditionally, semiconductor devices use wire bonds to connect devices from substrates or other active components. Due to the shrinking size of chips and demand for more sophisticated structures, demand for flip chips with controlled collapse chip connection (C4) technology has grown significantly. Features such as improved thermal heat transfer and improved performance at higher frequencies have also driven the market for flip chips.

Various wafer bumping technologies, such as tin-lead (Sn-Pb) and gold stud bumping, are used extensively in flip chip bumping and account for the major share of the market. However, government regulations and the high cost of the materials used in these processes are expected to result in them being replaced by copper (Cu) pillar bumping, as it is a high-performance, low-cost, and nontoxic process. In terms of applications of Cu pillar bumping, communication devices and other computing devices are expected to drive the market in the near term.

Severe warpage of a substrate after the flip chip assembly process may lead to fracture of solder joints, underfill delamination or underfill cracks, decreasing the lifespan of chips. Recent work has shown that the unstable contact resistance of electrically conductive adhesives on copper and tin is due to electrochemical corrosion of these metals under elevated temperature and humidity conditions.

Technological advancements include a new class of conductive adhesives that exhibit exceptional contact resistance stability on surfaces including organic solderability preservative (OSP) copper, Sn alloys and even 100% Sn. Advancements such as this have reduced lead times. Demand for flip chips in applications such as the CMOS 28 nm IC and new applications such as application processor engines, base band modules, double data rate memory and the 3DIC/2.5D interposer, using micro bumping, is expected to increase in the near future.

Click for report details: ..

Browse all Information Technology Market Research Reports ..

Browse all Information Technology Company Profile Reports ..

Browse all Latest Market Research Reports ..

About Us is a leading online business information aggregator with over 300,000 market reports and company profiles available to our clients. Our extensive range of reports are sourced from the leading publishers of business information and provide clients with the widest range of information available. In terms of company profiles,’s online database allows clients access to market and corporate information to over 100,000 different companies. We provide clients with a fully indexed database of information where clients can find specific market reports on their niche industry sectors of interest.

Press Information

Published by
Mike King
London: +44 (0) 203 086 8600

# 726 Words
Related Articles
More From Finance
P2P lending platform Monexo partners with IDBI-Trusteeship [..]
For Immediate Release: 2nd September 2016 MUKESH BUBNA, CEO Monexo Fintech Pvt Limited P2P [..]
Day Trade to Win New September Class [..]
Sold Out? New Class Added – On September 6, 2016, is launching a brand new eight-week trading boot camp [..]
FTM (Forget The Market) Reopens 3 Shares [..]
Port Vila, Vanuatu, 28th July 2016 - Investment firm FTM today announced the reopening of three separate share options, projected [..]
Ex-Citibanker Launching Online P2P marketplace in India [..]
A study conducted by World Bank shows that MSMEs in India face an estimated credit gap of INR 20.9 trillion [..]
New Frontier Portfolios Top Morningstar Rankings
New Frontier’s global strategic portfolios topped the Global Balanced Strategic/All-Inclusive category of the latest Morningstar ETF [..]

Disclaimer: If you have any questions regarding information in this press release please contact the company added in the press release. Please do not contact pr-inside. We will not be able to assist you. PR-inside disclaims the content included in this release.