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Global 3D semiconductor packaging market: 58% CAGR between 2012-2016
Global 3D Semiconductor Packaging Market 2012-2016 - a new market research report on 2014-03-04 17:55:03
The Global 3D Semiconductor Packaging market is to grow at a CAGR of 58.1 percent over the period 2012-2016. One of the key factors contributing to this market growth is the necessity to control rising design costs. The Global 3D Semiconductor Packaging market has also been witnessing a drive toward total semiconductor packaging solutions. However, the cyclical nature of the Global Semiconductor market could pose a challenge to the growth of this market.

The semiconductor packaging companies are expected to have large packaging capacities as a primary criterion to receive orders from the semiconductor chip manufacturers. The semiconductor chip manufacturers tend to prefer to outsource their packaging to one capable and reliable vendor rather than to a number of vendors. As a result, the players in this market are increasing their capacity in terms of machinery as well as staffing levels to cope with the demand from their customers.

The Global 3D Semiconductor Packaging market has several factors driving the market. The key growth factor is the need to reduce the rising costs involved in designing a compact device with significant power efficiency. In order to design and manufacture such a device, the players in the Global Semiconductor market are focusing more on 3D semiconductor packaging.

The key vendors dominating this market space are Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Powertech Technology Inc., and Siliconware Precision Industries Co. Ltd.

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